Patent Assignment
Reel/Frame 018113/0702
Assignment of Assignor's Interest
Recorded: 2006-07-19
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU 503-8604, JAPAN
Covered Property
(1)
Substrate for Mounting Ic Chip, Substrate for Motherboard, Device for Optical Communication, Manufacturing Method of Substrate for Mounting Ic Chip, and Manufacturing Method of Substrate for Motherboard