IP Library › Assignment 018117/0600
Patent Assignment
Reel/Frame 018117/0600

Assignment of Assignor's Interest

Recorded: 2006-07-20 Pages: 2
Assignors
KIM, YOUNG SUK
Executed: 2006-07-06
OH, YOUNG SOO
Executed: 2006-07-06
KIM, HYOUNG HO
Executed: 2006-07-06
LEE, TAEK JUNG
Executed: 2006-07-06
CHOI, SEOG MOON
Executed: 2006-07-06
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Led Package and Fabricating Method Thereof
Patent: 7,453,093 →
Application: 11/489,578 →
Publication: US 2007/0018190
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →