Patent Assignment
Reel/Frame 018130/0313
Assignment of Assignor's Interest
Recorded: 2006-07-26
Pages: 3
Assignors
KAWAMURA, TOSHINORI
Executed: 2006-06-12
AKAHOSHI, HARUO
Executed: 2006-06-12
ARAI, KUNIO
Executed: 2006-06-06
Assignee
HITACHI VIA MECHANICS, LTD.
2100 KAMI-IMAIZUMI EBINA-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Manufacturing Method of Printed Wiring Board as Well as Copper-Clad Laminate and Treatment Solutions Used Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.