Patent Assignment
Reel/Frame 018131/0001
Merger
Recorded: 2006-07-26
Pages: 37
Assignor
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Executed: 2006-04-03
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Resin Application Method on Panel, and Manufacturing Method of Panel for Display
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 2003
From: WADA, KENYA; ONOSHIRO, JUN; HIRASEKO, KOUJI
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014628/0463 →
Change of Name
Jul 27, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015642/0021 →