IP Library Assignment 015642/0021
Patent Assignment
Reel/Frame 015642/0021

Change of Name

Recorded: 2004-07-27 Pages: 3
Assignor
Assignee
HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
16-3, HIGASHI 3-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Properties (16)
Inspecting Method and Apparatus for Repeated Micro-Miniature Patterns
Patent: 6,661,912 →
Application: 09/127,960 →
Apparatus and Method for Testing Defects
Patent: 6,411,377 →
Application: 09/362,135 →
Method of manufacturing semiconductor device
Patent: 6,365,425 →
Application: 09/604,251 →
Apparatus Method of Inspecting Foreign Particle or Defect on a Sample
Patent: 6,597,448 →
Application: 09/644,069 →
Method of Inspecting a Semiconductor Device and an Apparatus Thereof
Patent: 6,888,959 →
Application: 09/791,682 →
Publication: US 2001/0048761
Surface Inspection Apparatus and Method Thereof
Patent: 6,894,302 →
Application: 09/791,742 →
Publication: US 2001/0030296
Apparatus for Detecting Foreign Particle and Defect and the Same Method
Patent: 6,731,384 →
Application: 09/973,000 →
Publication: US 2002/0041374
.Apparatus and Method for Inspecting Defects
Patent: 7,187,438 →
Application: 10/050,776 →
Publication: US 2002/0122174
Apparatus and Method for Testing Defects
Patent: 7,037,735 →
Application: 10/170,378 →
Publication: US 2002/0168787
Apparatus and Method for Measuring Alignment Accuracy, as Well as Method and System for Manufacturing Semiconductor Device
Patent: 6,897,956 →
Application: 10/235,656 →
Publication: US 2003/0160960
Resin Application Method on Panel, and Manufacturing Method of Panel for Display
Patent: 7,204,948 →
Application: 10/445,958 →
Publication: US 2004/0141109
System for Monitoring Foreign Particles, Process Processing Apparatus and Method of Electronic Commerce
Patent: 7,196,785 →
Application: 10/630,734 →
Publication: US 2004/0021856
Inspecting Method and Apparatus for Repeated Micro-Miniature Patterns
Patent: 6,944,325 →
Application: 10/656,221 →
Publication: US 2004/0047500
Inspection Method and Inspection Apparatus
Patent: 7,315,363 →
Application: 10/722,531 →
Publication: US 2004/0105093
Method for Inspecting Defect and Apparatus for Inspecting Defect
Patent: 7,248,352 →
Application: 10/724,750 →
Publication: US 2004/0160599
A Testing Apparatus for Conducting a Test on a Magnetic Recording Medium or a Magnetic Head Through Recording Test Data on the Magnetic Recording Medium and Reproducing Recorded Test Data Therefrom by Means of the Magnetic Head
Patent: 6,894,489 →
Application: 10/735,909 →
Publication: US 2004/0124832
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 28, 2001
From: OSHIMA, YOSHIMASA; NOGUCHI, MINORI; NISHIYAMA, HIDETOSHI; MITOMO, KENJI
To: HITACHI, LTD.; HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 012403/0268 →
Assignment of Assignor's Interest Jul 31, 2003
From: NISHIYAMA, HIDETOSHI; NOGUCHI, MINORI; WATANABE, TETSUYA; SEKIGUCHI, TAKUAKI
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014348/0696 →
Assignment of Assignor's Interest Aug 5, 2003
From: TAGUCHI, JUNICHI; SUGIMOTO, ARITOSHI; IKOTA, MASAMI; INOUE, YUKO
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014353/0139 →
Corrective Assignment to Correct the First Assignor's Last Name, Previously Recorded at Reel 013620 Frame 0275. Sep 2, 2003
From: NOGUCHI, MINORI; NAKADA, MASAHIKO; SUZUKI, TAKAHIKO; UENO, TAKETO
To: HITACHI, LTD.; HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014452/0692 →
Assignment of Assignor's Interest Oct 20, 2003
From: WADA, KENYA; ONOSHIRO, JUN; HIRASEKO, KOUJI
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014628/0463 →
Assignment of Assignor's Interest Nov 28, 2003
From: HAMAMATSU, AKIRA; NOGUCHI, MINORI; NISHIYAMA, HIDETOSHI; OHSHIMA, YOSHIMASA
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014748/0046 →
Assignment of Assignor's Interest May 3, 2004
From: HAMAMATSU, AKIRA; NOGUCHI, MINORI; NISHIYAMA, HIDETOSHI; OHSHIMA, YOSHIMASA
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015292/0916 →
Assignment of Assignor's Interest Jul 21, 2005
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016547/0110 →
Assignment of Assignor's Interest Jul 21, 2005
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016547/0118 →
Merger Jul 26, 2006
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 018131/0001 →
Assignment of Assignor's Interest Mar 25, 2011
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0976 →
Change of Name and Address Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →