IP Library › Assignment 016547/0118
Patent Assignment
Reel/Frame 016547/0118

Assignment of Assignor's Interest

Recorded: 2005-07-21 Pages: 3
Assignor
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHISHINBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties (11)
System Quality Control Where Inspection Frequency of Inspection Apparatus Is Reset to Minimize Expected Total Loss Based on Derived Frequency Function and Loss Value
Patent: 6,002,989 →
Application: 08/831,298 →
Apparatus and Method for Testing Defects
Patent: 6,411,377 →
Application: 09/362,135 →
Method of manufacturing semiconductor device
Patent: 6,365,425 →
Application: 09/604,251 →
Apparatus Method of Inspecting Foreign Particle or Defect on a Sample
Patent: 6,597,448 →
Application: 09/644,069 →
Method of Inspecting a Semiconductor Device and an Apparatus Thereof
Patent: 6,888,959 →
Application: 09/791,682 →
Publication: US 2001/0048761
Surface Inspection Apparatus and Method Thereof
Patent: 6,894,302 →
Application: 09/791,742 →
Publication: US 2001/0030296
Apparatus for Detecting Foreign Particle and Defect and the Same Method
Patent: 6,731,384 →
Application: 09/973,000 →
Publication: US 2002/0041374
.Apparatus and Method for Inspecting Defects
Patent: 7,187,438 →
Application: 10/050,776 →
Publication: US 2002/0122174
Method for Analyzing Defect Data and Inspection Apparatus and Review System
Patent: 6,876,445 →
Application: 10/119,018 →
Publication: US 2002/0181756
Method and Its Apparatus for Inspecting Particles or Defects of a Semiconductor Device
Patent: 6,936,835 →
Application: 10/230,416 →
Publication: US 2003/0001120
Apparatus and Method for Measuring Alignment Accuracy, as Well as Method and System for Manufacturing Semiconductor Device
Patent: 6,897,956 →
Application: 10/235,656 →
Publication: US 2003/0160960
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 28, 2001
From: OSHIMA, YOSHIMASA; NOGUCHI, MINORI; NISHIYAMA, HIDETOSHI; MITOMO, KENJI
To: HITACHI, LTD.; HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 012403/0268 →
Corrective Assignment to Correct the First Assignor's Last Name, Previously Recorded at Reel 013620 Frame 0275. Sep 2, 2003
From: NOGUCHI, MINORI; NAKADA, MASAHIKO; SUZUKI, TAKAHIKO; UENO, TAKETO
To: HITACHI, LTD.; HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014452/0692 →
Change of Name Jul 27, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015642/0021 →
Change of Name Aug 18, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015065/0870 →
Assignment of Assignor's Interest Mar 25, 2011
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0976 →
Assignment of Assignor's Interest Feb 3, 2017
From: HITACHI, LTD.
To: HITACHI HI-TECHNOLOGIES CORPORATION
Reel/Frame 041164/0139 →
Change of Address Feb 3, 2017
From: HITACHI, LTD.
To: HITACHI, LTD.
Reel/Frame 041610/0882 →
Corrective Assignment to Correct the Address Previously Recorded on Reel 041164 Frame 0139. Assignor(S) Hereby Confirms the Address Should Be High-Technologies and Not Hi-Technologies. Feb 9, 2017
From: HITACHI, LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 041666/0181 →
Change of Name and Address Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →