Patent Assignment
Reel/Frame 026109/0976
Assignment of Assignor's Interest
Recorded: 2011-03-25
Received: 2011-03-25
Pages: 9
Assignor
HITACHI, LTD.
Executed: 2011-03-07
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(98)
Semiconductor Device and Method of Manufacturing the Same
Application:
11/154,803 →
Semiconductor Integrated Circuit Device Including First, Second and Third Gates
Application:
11/061,843 →
Semiconductor Device and Method for Fabricating the Same
Application:
10/986,495 →
Non-Volatile Semiconductor Memory Device and Semiconductor Disk Device
Application:
10/975,818 →
Plastic Molded Type Semiconductor Device and Fabrication Process Thereof
Application:
10/777,084 →
Semiconductor Integrated Circuit Device Including First, Second and Third Gates
Application:
10/674,051 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
10/669,564 →
Semiconductor Device Including N-Channel Fets and P-Channel Fets with Improved Drain Current Characteristics
Application:
10/625,616 →
Semiconductor Device and Process of Producing the Same
Application:
10/460,215 →
Heterojunction bipolar transistor
Application:
10/457,428 →
Semiconductor integrated circuit device capable of switching mode for trimming internal circuitry through JTAG boundary scan method
Application:
10/359,707 →
Analog Switch Circuit
Application:
10/283,110 →
Semiconductor Integrated Circuit Device
Application:
10/173,433 →
Nonvolatile Semiconductor Memory Device
Application:
10/173,305 →
Nonvolatile Semiconductor Memory with Controlled Supply of Boosted Voltage
Application:
10/171,768 →
Voltage Booster Circuit Apparatus
Application:
10/154,852 →
Semiconductor Device
Application:
10/134,522 →
Method of Producing a Semiconductor Device Having Two Semiconductor Chips Sealed by a Resin
Application:
10/133,583 →
Level Conversion Circuit and Semiconductor Integrated Circuit Device Employing the Level Conversion Circuit
Application:
10/122,178 →
Semiconductor Device
Application:
10/115,986 →
Semiconductor Device and a Method of Manufacturing the Same
Application:
10/108,483 →
Semiconductor Device Having Bumper Portions Integral with a Heat Sink
Application:
10/103,988 →
Cache Memory Employing Dynamically Controlled Data Array Start Timing and a Microcomputer Using the Same
Application:
10/084,229 →
Nonvolatile Storage System
Application:
10/082,084 →
Semiconductor Device
Application:
10/067,902 →
Nonvolatile Semiconductor Memory and Read Method
Application:
10/066,701 →
Ball Grid Array Type Semiconductor Package Having a Flexible Substrate
Application:
10/059,341 →
Ball Grid Array Type Semiconductor Package Having a Flexible Substrate
Application:
10/059,338 →
Semiconductor Device and Method of Fabricating the Same
Application:
10/051,009 →
Semiconductor Device and Method of Fabricating the Same
Application:
10/051,077 →
Semiconductor Device with Two Stacked Chips in One Resin Body and Method of Producing
Application:
10/032,578 →
Nonvolatile Memory System
Application:
10/023,882 →
Process for Manufacturing Semiconductor Integrated Circuit Device Including Treatment of Gas Used in the Process
Application:
10/013,729 →
Semiconductor Integrated Circuit
Application:
10/013,474 →
Nonvolatile Memory and Method of Programming the Same Memory
Application:
10/012,549 →
Semiconductor Storage Device
Application:
10/006,670 →
Semiconductor Integrated Circuit Device and Method for Making the Same
Application:
09/998,644 →
Method of Manufacturing a Semiconductor Device Using Reinforcing Patterns for Ensuring Mechanical Strength During Manufacture
Application:
09/987,532 →
Non-Volatile Semiconductor Memory Device for Selectively Re-Checking Word Lines
Application:
09/986,081 →
Semiconductor Integrated Circuit and Data Processing System
Application:
09/985,188 →
Externally Aligned Laser Module
Application:
09/998,962 →
Process for Manufacturing Semiconductor Integrated Circuit Device Including Treatment of Gas Used in the Process
Application:
09/982,173 →
Mehtod of Manufacturing Chip Dicing and Chip Scale Packaging
Application:
09/978,724 →
Nonvolatile Memory and Semiconductor Device with Controlled Voltage Booster Circuit
Application:
09/970,675 →
Semiconductor Device, Data Processing System and a Method for Changing Threshold of a Non-Volatile Memory Cell
Application:
09/965,800 →
Semiconductor Ic Device Having a Memory and a Logic Circuit Implemented with a Single Chip
Application:
09/964,615 →
Analog Switch Circuit
Application:
09/960,925 →
Semiconductor Integrated Circuit
Application:
09/956,996 →
Semiconductor Non-Volatile Storage
Application:
09/951,979 →
Circuit Design Method and Circuit Design Apparatus
Application:
09/939,590 →
Semiconductor Device, Microcomputer and Flash Memory
Application:
09/939,708 →
Timing-Control Circuit Device and Clock Distribution System
Application:
09/935,717 →
Semiconductor Integrated Circuit Device and Method for Making the Same
Application:
09/933,163 →
Semiconductor Device
Application:
09/930,943 →
Semiconductor Device
Application:
09/930,942 →
Semiconductor Integrated Circuit and Data Processing System
Application:
09/931,030 →
Liquid Crystal Driving Circuit and Liquid Crystal Display Device
Application:
09/928,424 →
Flash Memory Control Method and Apparatus Processing System Therewith
Application:
09/927,493 →
Semiconductor Integrated Circuit Device and Manufacturing Method Thereof
Application:
09/924,588 →
Processing System with Microcomputers Each Operable in Master and Slave Modes Using Configurable Bus Access Control Terminals and Bus Use Priority Signals
Application:
09/918,625 →
Clock Generation Circuit, Control Method of Clock Generation Circuit, Clock Reproducing Circuit, Semiconductor Memory Device, and Dynamic Random Access Memory
Application:
09/903,830 →
Liquid-Crystal Display Control Apparatus
Application:
09/893,531 →
Nonvolatile Semiconductor Memory
Application:
09/883,236 →
Semiconductor Integrated Circuit and Nonvolatile Semiconductor Memory
Application:
09/883,237 →
Radio Communication Apparatus and Radio Frequency Power Amplifier
Application:
09/881,013 →
Semiconductor Integrated Circuit
Application:
09/875,165 →
Semiconductor Device Having Switching Elements Around a Central Control Circuit
Application:
09/859,408 →
Semiconductor Integrated Circuit Device
Application:
09/859,045 →
Directional Coupler, High Frequency Circuit Module and Wireless Communication System
Application:
09/848,368 →
Semiconductor Memory, Memory Device, and Memory Card
Application:
09/845,350 →
Semiconductor Integrated Circuit Device
Application:
09/830,416 →
A Semiconductor Device Switching Regulator Used as a Dc Regulated Power Supply
Application:
09/842,015 →
Level Conversion Circuit and Semiconductor Integrated Circuit Device Employing the Level Conversion Circuit
Application:
09/833,627 →
Plastic Molded Type Semiconductor Device and Fabrication Process Thereof
Application:
09/832,008 →
Nonvolatile Semiconductor Memory and Read Method
Application:
09/828,967 →
A Semiconductor Device
Application:
09/826,965 →
Cell Phone with Instruction Pre-Fetch Buffers Allocated to Low Bit Address Ranges and Having Validating Flags
Application:
09/824,186 →
Pll Circuit and Wireless Mobile Station with That Pll Circuit
Application:
09/820,881 →
Semiconductor Device
Application:
09/820,972 →
Semiconductor Integrated Circuit Device and Contactless Electronic Device
Application:
09/811,443 →
Semiconductor IC device having a memory and a logic circuit implemented with a single chip
Application:
09/808,943 →
Direct-Current Power-Supply Apparatus, Control Circuit Thereof and Semiconductor Integrated Circuit Device for Power Supply
Application:
09/809,997 →
Semiconductor Device
Application:
09/797,719 →
Semiconductor Device Having Bumper Portions Integral with a Heat Sink
Application:
09/794,040 →
Method of Manufacturing Ic Cards
Application:
09/763,082 →
Bus Controller with Instruction Pre-Fetch Buffers with Flag and Allocated to Different Range of Address
Application:
09/783,551 →
Semiconductor Device
Application:
09/779,609 →
Semiconductor Device and Manufacturing Method Thereof
Application:
09/771,648 →
Semiconductor device and manufacturing method thereof
Application:
09/771,670 →
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Application:
09/770,494 →
Nonvolatile Semiconductor Memory Device
Application:
09/769,358 →
Semiconductor device and manufacturing method thereof
Application:
09/768,451 →
Semiconductor Device and Manufacturing Method Thereof
Application:
09/765,376 →
Semiconductor device and manufacturing method thereof
Application:
09/764,378 →
Semiconductor device
Application:
09/761,572 →
Semiconductor device and manufacturing method thereof
Application:
09/760,733 →
Semiconductor device and process for producing the same
Application:
09/760,777 →
Non-Volatile Semiconductor Memory Device and Semiconductor Disk Device
Application:
09/758,221 →