Semiconductor device and a method of manufacturing the same
View Patent ↗The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.
1. A method of manufacturing a semiconductor device, comprising the steps of:
providing a lead frame having a front face, a back face opposed of the front face, a tub and a plurality of leads arranged around the tub wherein a back face of the tub is etched off and each of the leads is thicker than the tub;
providing a semiconductor chip having a principal face, a back face and a plurality of electrodes formed on the principal face;
bonding the back face of the semiconductor chip on the front face of the tub;
electrically connecting the plurality of electrodes with the plurality of leads via a plurality of wires, respectively;
providing a molding die having an upper part and a lower part wherein the lower part has a cavity;
arranging the lead frame between the upper part and the lower part as the bonded semiconductor chip is positioned in the cavity of the lower part and the back face of the tub is facing the upper part; and
after the arranging step, injecting a resin in the cavity for sealing the semiconductor chip, the tub, the plurality of wires, and a part of each of the plurality of leads in the resin,
wherein the back face of the tub is entirely sealed by the resin, and
wherein a part of the resin which covers the back face of the tub is thinner than the leads.
2. A method of manufacturing a semiconductor device, comprising the steps of:
providing a lead frame having a front face, a back face opposed of the front face, a tub and a plurality of leads arranged around the tub wherein a back face of the tub is etched off and each of the leads is thicker than the tub;
providing a semiconductor chip having a principal face, a back face and a plurality of electrodes formed on the principal face;
bonding the back face of the semiconductor chip on the front face of the tub;
electrically connecting the plurality of electrodes with the plurality of leads via a plurality of wires, respectively;
providing a molding die having an upper part and a lower part wherein the lower part has a cavity;
arranging the lead frame between the upper part and the lower part as the bonded semiconductor chip is positioned in the cavity of the lower part and the back face of the tub is facing the upper part; and
after the arranging step, injecting a resin in the cavity for sealing the semiconductor chip, the tub, the plurality of wires, and a part of each of the plurality of leads in the resin,
wherein the back face of the tub is entirely sealed by the resin, and
wherein a front face of the tub is smaller than the back face of the semiconductor chip.
3. A method of manufacturing a semiconductor device according to claim 2 , wherein the lead frame has a frame portion and tub suspending leads, the plurality of leads are supported with the frame portion, and the tub is supported with the frame portion via the tub suspending leads.
4. A method of manufacturing a semiconductor device according to claim 3 , wherein the tub suspending leads are connected to the tub under the back face of the semiconductor chip.
5. A method of manufacturing a semiconductor device according to claim 4 , wherein back faces of the tub suspending leads at portions that connect the tub are etched off.
6. A method of manufacturing a semiconductor device according to claim 5 , wherein back faces of the tub suspending leads at portions under the back face of the semiconductor chip are etched off.
7. A method of manufacturing a semiconductor device according to claim 6 , wherein, in the resin injecting step, back faces of the tub suspending leads at portions of etched off are sealed by the resin.
8. A method of manufacturing a semiconductor device according to claim 7 , wherein, in the resin injecting step, injecting the resin between front faces of the tub suspending leads and the back face of the semiconductor chip under the back face of the semiconductor chip.
9. A method of manufacturing a semiconductor device according to claim 8 , wherein a part of the resin which covers the back face of the tub is thinner than the leads.
10. A method of manufacturing a semiconductor device according to claim 9 , wherein a part of the resin which covers the back faces of the tub suspending leads is thinner than the leads.