IP Library Assignment 042595/0189
Patent Assignment
Reel/Frame 042595/0189

Merger

Recorded: 2017-05-12 Pages: 14
Assignor
Assignee
NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
145, AZA NAKAJIMA, NANAE-CHO, KAMEDA-GUN, HOKKAI-DO, JAPAN
Covered Properties (14)
Semiconductor Device and a Method of Manufacturing the Same
Patent: 6,399,423 →
Application: 09/733,929 →
Publication: US 2001/0041424
Semiconductor Package with Elevated Tub
Patent: 6,700,193 →
Application: 09/988,645 →
Publication: US 2002/0079563
Semiconductor Device and a Method of Manufacturing the Same
Patent: 6,667,193 →
Application: 10/108,439 →
Publication: US 2002/0106836
Semiconductor Device and a Method of Manufacturing the Same
Patent: 6,590,276 →
Application: 10/108,483 →
Publication: US 2002/0102771
Mold Cleaning Sheet and Method for Producing Semiconductor Devices Using the Same
Patent: 7,384,582 →
Application: 10/296,724 →
Publication: US 2003/0131428
Semiconductor Device and a Method of Manufacturing the Same
Patent: 6,897,097 →
Application: 10/669,564 →
Publication: US 2004/0058479
Method of Manufacturing a Semiconductor Package with Elevated Tub
Patent: 6,943,064 →
Application: 10/752,676 →
Publication: US 2004/0140541
Manufacturing Method of a Semiconductor Device
Patent: 7,407,834 →
Application: 10/902,785 →
Publication: US 2005/0003586
Mold Cleaning Sheet and Manufacturing Method of a Semiconductor Device Using the Same
Patent: 7,537,967 →
Application: 11/218,603 →
Publication: US 2005/0285306
Mold Cleaning Sheet and Method of Producing Semiconductor Devices Using the Same
Patent: 7,572,398 →
Application: 11/431,508 →
Publication: US 2006/0197258
Manufacturing Method of a Semiconductor Device
Patent: 7,459,347 →
Application: 12/213,779 →
Publication: US 2008/0268578
Mold Cleaning Sheet and Manufacturing Method of a Semiconductor Device Using the Same
Patent: 7,943,432 →
Application: 12/424,075 →
Publication: US 2009/0203173
Mold Cleaning Sheet and Method of Producing Semiconductor Devices Using the Same
Patent: 7,837,908 →
Application: 12/494,891 →
Publication: US 2009/0263940
Mold Cleaning Sheet and Method of Producing Semiconductor Devices Using the Same
Patent: 8,070,992 →
Application: 12/906,421 →
Publication: US 2011/0033984
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger and Change of Name May 12, 2017
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 042355/0837 →
Assignment of Assignor's Interest May 12, 2017
From: MATSUURA, TAKAO; YAMAGUCHI, YOSHIHIKO; KOBAYASHI, SHOUICHI; TSUCHIYA, KOUJI
To: HITACHI, LTD.; HITACHI YONEZAWA ELECTRONICS CO., LTD.
Reel/Frame 042355/0873 →
Assignment of Assignor's Interest May 12, 2017
From: TSUCHIDA, KIYOSHI
To: HITACHI, LTD.; HITACHI YONEZAWA ELECTRONICS CO., LTD.
Reel/Frame 042355/0882 →
Assignment of Assignor's Interest May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042355/0912 →
Assignment of Assignor's Interest May 12, 2017
From: TSUCHIDA, KIYOSHI
To: HITACHI, LTD.; HITACHI YONEZAWA ELECTRONICS CO., LTD.
Reel/Frame 042355/0983 →
Assignment of Assignor's Interest May 12, 2017
From: SHIMANUKI, YOSHIHIKO
To: HITACHI, LTD.; HITACHI YONEZAWA ELECTRONICS CO., LTD.
Reel/Frame 042355/0993 →
Change of Name May 12, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0022 →
Change of Name May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →