Method of manufacturing a semiconductor package with elevated tub
View Patent ↗The semiconductor device includes tub 5 that is smaller than semiconductor chip 8 , and which supports semiconductor chip 8 ; molded section 12 that is formed by resin-molding around semiconductor chip 8 ; suspension leads 4 , including supporting portions 4 a that support tub 5 and exposed portions 4 b that are connected to supporting portions 4 a and are exposed on back surface 12 a of molded section 12 , and are elevation processed in supporting portions 4 a ; leads 2 that are located around tub 5 ; and wires 10 that connect pads 7 of the semiconductor chip 8 with the corresponding leads 2 ; wherein the thickness of tub 5 and supporting portions 4 a of suspension leads 4 is less than the thickness of exposed portions 4 b , and back surface 8 b of semiconductor chip 8 is firmly in contact with molding resin 11.
1. A method of manufacturing a semiconductor device comprising the steps of:
providing a leadframe having a major and back surfaces opposite each other, a frame section, a tub arranged in the frame section, suspension leads suspending the tub from the frame section and leads arranged in the frame section and respectively connecting the frame section;
providing a semiconductor chip having a major surface on which semiconductor elements and bonding pads are formed and a back surface opposite to the major surface thereof;
bonding the back surface of the semiconductor chip on a major surface of the tub;
electrically connecting the bonding pads with major surfaces of leads via wires;
forming resin body sealing the semiconductor chip, the wires, and a back surface of the tub therein,
wherein back surfaces of the leads are exposed from the resin body;
wherein the tub is thinner than the leads;
wherein the major surface of the tub is arranged higher than the major surfaces of the leads in the resin body; and
wherein the tub is thinned by etching the back surface thereof.
2. A method of manufacturing as semiconductor device according to claim 1 , wherein the suspension leads are upset processed.
3. A method of manufacturing a semiconductor device according to claim 1 , further comprising a step of separating the suspension leads and the leads from the frame section.
4. A method of manufacturing a semiconductor device comprising the steps of:
providing a leadframe having a major and back surfaces opposite each other, a frame section, a tub arranged in the frame section, suspension leads suspending the tub from the frame section and leads arranged in the frame section and respectively connecting the frame section;
providing a semiconductor chip having a major surface on which semiconductor elements and bonding pads are formed and a back surface opposite to the major surface thereof;
bonding the back surface of the semiconductor chip on a major surface of the tub;
electrically connecting the bonding Dads with major surfaces of leads via wires;
forming resin body sealing the semiconductor chip, the wires, and a back surface of the tub therein, wherein back surfaces of the leads are exposed from the resin body:
wherein the tub is thinner than the leads;
wherein the major surface of the tub is arranged higher than the major surfaces of the leads in the resin body; and
wherein the major surface of the tub is smaller than the back surface of the semiconductor chip, and a part of the back surface of the semiconductor chip is bonded with the resin body.
5. A method of manufacturing a semiconductor device according to claim 4 , wherein the tub is thinned by etching the back surface thereof.
6. A method of manufacturing as semiconductor device according to claim 4 , wherein the suspension leads are upset processed.
7. A method of manufacturing a semiconductor device according to claim 4 , further comprising a step of separating the suspension leads and the leads from the frame section.