Patent Assignment
Reel/Frame 042355/0983
Assignment of Assignor's Interest
Recorded: 2017-05-12
Pages: 3
Assignor
TSUCHIDA, KIYOSHI
Executed: 2002-02-13
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI YONEZAWA ELECTRONICS CO., LTD.
3-3274, AZA YAGIHASHIHIGASI, OAZA HANAZAWA, YONEZAWA-SHI, YAMAGATA, JAPAN
Covered Properties
(2)
Mold Cleaning Sheet and Manufacturing Method of a Semiconductor Device Using the Same
Mold Cleaning Sheet and Manufacturing Method of a Semiconductor Device Using the Same
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042355/0912 →
Change of Name
May 12, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0022 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: HITACHI YONEZAWA ELECTRONICS CO., LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042595/0189 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →