Mold cleaning sheet and manufacturing method of a semiconductor device using the same
View Patent ↗A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of the molding die, the cleaning sheet main body being formed with first through holes at positions corresponding to the cavities of the molding die, air vent slits and flow cavity recesses at positions corresponding to the air vents of the cavities, second through holes at positions corresponding to the pots of the molding die, and slits at positions corresponding to the runners of the molding die, thereby capable of improving the cleaning effect of the molding die and shortening the time for the cleaning operation to improve the productivity.
1. A method of manufacturing a semiconductor device by using a cleaning sheet for cleaning a molding die, comprising the steps of:
(a) providing the molding die having a first mold, a second mold opposing to the first mold, the second mold having pots, cavities arranged around the pots, and runners arranged between the pots and the cavities, wherein the first mold has a first main surface, wherein the second mold has a second main surface opposing to the first main surface, wherein the pots are formed on the second main surface of the second mold, and wherein the cavities are connected with the pots by way of the runners, respectively
(b) providing the cleaning sheet having an opening, wherein a planar shape of the cleaning sheet is a frame shape;
(c) disposing cleaning resin into the pots, respectively;
(d) disposing the cleaning sheet between the first mold and the second mold such that the pots, the runners and the cavities are arranged inside of the opening of the cleaning sheet in a plane view;
(e) clamping the cleaning sheet with the first main surface of the first mold and the second main surface of the second mold;
(f) supplying the cleaning resins into the cavities from the pots by way of the opening of the cleaning sheet and the runners, respectively;
(g) hardening the cleaning resins;
(h) releasing the cleaning sheet from between the first mold and the second mold, wherein the hardened cleaning resin is attached to the cleaning sheet;
(i) disposing encapsulating resin into the pots;
(j) disposing semiconductor chips in the cavities, respectively; and
(k) supplying the encapsulating resin into the cavities from the pots by way of the runners, respectively.
2. The method of manufacturing the semiconductor device according to claim 1 , wherein the cleaning sheet is comprised of paper which is not capable of being impregnated or permeated with the cleaning resin.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein before the step (j), the semiconductor chips are mounting over a leadframe having a plurality of leads, and are electrically connected with the plurality of leads by way of wires.
4. The method of manufacturing the semiconductor device according to claim 2 , wherein before the step (j), the semiconductor chips are mounting over a leadframe having a plurality of leads, and are electrically connected with the plurality of leads by way of wires.
5. The method of manufacturing the semiconductor device according to claim 1 , wherein the cavities are formed on the first main surface of the first mold and the second main surface of the second mold; and
wherein the cavities formed on the first mold are arranged at a portion opposing to the cavities formed on the second mold.
6. The method of manufacturing the semiconductor device according to claim 1 , wherein in the step (e), the cleaning sheet is clamped with a peripheral portion of the first main surface of the first mold and a peripheral portion of the second main surface of the second mold.