IP Library › Assignment 042355/0837
Patent Assignment
Reel/Frame 042355/0837

Merger and Change of Name

Recorded: 2017-05-12 Pages: 6
Assignors
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties (7)
Fabrication Method of Semiconductor Integrated Circuit Device
Patent: 8,117,742 →
Application: 12/729,102 →
Publication: US 2010/0233857
Fabrication Method of Semiconductor Integrated Circuit Device
Patent: 7,861,912 →
Application: 12/836,432 →
Publication: US 2010/0279464
Mold Cleaning Sheet and Method of Producing Semiconductor Devices Using the Same
Patent: 8,070,992 →
Application: 12/906,421 →
Publication: US 2011/0033984
Fabrication Method of Semiconductor Integrated Circuit Device
Patent: 8,074,868 →
Application: 12/956,524 →
Publication: US 2011/0070696
Mosfet Package
Patent: 8,455,986 →
Application: 13/459,839 →
Publication: US 2012/0217556
Fabrication Method of Semiconductor Integrated Circuit Device
Patent: 8,640,943 →
Application: 13/607,864 →
Publication: US 2012/0329211
Mosfet Package
Patent: 8,816,411 →
Application: 13/906,771 →
Publication: US 2013/0264696
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Address of Assignee Aug 27, 2013
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 031095/0721 →
Assignment of Assignor's Interest May 12, 2017
From: TSUCHIDA, KIYOSHI
To: HITACHI, LTD.; HITACHI YONEZAWA ELECTRONICS CO., LTD.
Reel/Frame 042355/0882 →
Assignment of Assignor's Interest May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042355/0912 →
Assignment of Assignor's Interest May 12, 2017
From: KAJIWARA, RYOICHI; KOIZUMI, MASAHIRO; MORITA, TOSHIAKI; TAKAHASHI, KAZUYA
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0139 →
Assignment of Assignor's Interest May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0150 →
Assignment of Assignor's Interest May 12, 2017
From: KURATOMI, BUNSHI; SHIMIZU, FUKUMI
To: RENESAS TECHNOLOGY CORP.; RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0290 →
Assignment of Assignor's Interest May 12, 2017
From: MAKI, HIROSHI; TANI, YUKIO
To: RENESAS TECHNOLOGY CORP.; RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0327 →
Change of Name May 12, 2017
From: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0022 →
Change of Name May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger May 12, 2017
From: HITACHI YONEZAWA ELECTRONICS CO., LTD.
To: NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042595/0189 →
Merger May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Merger Sep 20, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 043638/0393 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →