Patent Assignment
Reel/Frame 042356/0327
Assignment of Assignor's Interest
Recorded: 2017-05-12
Pages: 3
Assignees
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
3-2, FUJIHASHI 3-CHOME, OME-SHI, TOKYO, JAPAN
Covered Properties
(4)
Fabrication Method of Semiconductor Integrated Circuit Device
Fabrication Method of Semiconductor Integrated Circuit Device
Fabrication Method of Semiconductor Integrated Circuit Device
Fabrication Method of Semiconductor Integrated Circuit Device
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
May 12, 2017
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 042355/0837 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger
Sep 20, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 043638/0393 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →