Fabrication method of semiconductor integrated circuit device
View Patent ↗Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, then the matrix substrate is disposed above the semiconductor chips on the first heating stage, subsequently the semiconductor chips and the matrix substrate are bonded to each other temporarily by thermocompression bonding while heating the chips directly by the first heating stage, thereafter the temporarily bonded matrix substrate is disposed on a second heating stage adjacent to the first heating stage, and then on the second heating stage the semiconductor chips are thermocompression-bonded to the matrix substrate while being heated directly by the second heating stage.
1. A method of fabricating a semiconductor integrated circuit device, comprises the steps of:
providing a matrix substrate on which a plurality of device areas each for the semiconductor integrated circuit device are formed in a matrix array;
disposing the matrix substrate above a plurality of semiconductor chips;
establishing a temporary bonding between the plurality of semiconductor chips and the matrix substrate by pressurizing the plurality of semiconductor chips by a first pressure and heating the plurality of semiconductor chips;
after establishing the temporary bonding, disposing the plurality of semiconductor chips onto a heating stage and establishing a main bonding between the plurality of semiconductor chips and the matrix substrate by pressurizing, by a second pressure, the plurality of semiconductor chips corresponding respectively to a plurality of pressure blocks while heating the plurality of semiconductor chips directly by the heating stage, the plurality of pressure blocks each being supported for independent movement in corresponding relation to the plurality of semiconductor chips to bond the plurality of semiconductor chips to the matrix substrate by thermocompression bonding simultaneously in one or plural rows in a width direction of the matrix-arrayed device areas on the matrix substrate,
wherein the second pressure is higher than the first pressure, and
wherein, prior to disposing the plurality of semiconductor chips onto the heating stage, the plurality of pressure blocks and the heating stage are brought into contact with each other, and then, in this state, the pressure applied to the plurality of pressure blocks is raised gradually, and a point of change of a load imposed on a load change detecting means is detected by the load change detecting means, the load chance detecting means being connected to support block portions for supporting the plurality of pressure blocks to determine the magnitude of a set value of the pressure applied to the plurality of pressure blocks at the time of thermocompression-bonding the plurality of semiconductor chips disposed on the heating stage to the substrate.
2. The method according to claim 1 , wherein an organic substrate is used as the matrix substrate.
3. A method according to the claim 1 , wherein at a time of pinching and compression-bonding the matrix substrate and the plurality of semiconductor chips by the use of the plurality of pressure blocks and the heating stage, air at an initial pressure is applied to the plurality of pressure blocks prior to compression-bonding; then, in this state, the plurality of pressure blocks are brought into contact with the matrix substrate, or the plurality of semiconductor chips are brought into contact with the heating stage; and, thereafter, air at another pressure higher than the initial pressure is applied to the plurality of pressure blocks to effect thermocompression bonding.
4. A method according to the claim 1 , wherein the second pressure applied to the plurality of pressure blocks is raised gradually and a point of change of a load imposed on a load change detecting means is detected by the load change detecting means to determine the magnitude of the pressure applied to the plurality of semiconductor chips, the load change detecting means being connected to support block portions for supporting the plurality of pressure blocks.
5. A method according to the claim 1 , wherein the plurality of pressure blocks are pressurized by air through a single sheet-like elastic film.
6. The method according to claim 1 , wherein a first compression bonding unit conducts the temporary bonding and a second compression bonding unit conducts the main bonding.
7. A method of fabricating a semiconductor integrated circuit device, comprises the steps of:
(a) providing a matrix substrate on which a plurality of device areas each for the semiconductor integrated circuit device are formed in a matrix array;
(b) disposing a plurality of semiconductor chips onto a heating stage;
(c) disposing the matrix substrate above the plurality of semiconductor chips; and
(d) pressurizing the plurality of semiconductor chips corresponding respectively to a plurality of pressure blocks while heating the plurality of semiconductor chips directly by the heating stage, the plurality of pressure blocks each being supported for independent movement in corresponding relation to the plurality of semiconductor chips to bond the plurality of semiconductor chips to the matrix substrate by thermocompression bonding simultaneously in one or plural rows in a width direction of the matrix-arrayed device areas on the matrix substrate,
wherein, prior to the step (b), the plurality of pressure blocks and the heating stage are brought into contact with each other, and then, in this state, the pressure applied to the plurality of pressure blocks is raised gradually, and a point of change of a load imposed on a load change detecting means is detected by the load change detecting means, the load change detecting means being connected to support block portions for supporting the plurality of pressure blocks to determine the magnitude of a set value of the pressure applied to the plurality of pressure blocks at the time of thermocompression-bonding the plurality of semiconductor chips disposed on the heating stage to the substrate.