IP Library › Assignment 042356/0290
Patent Assignment
Reel/Frame 042356/0290

Assignment of Assignor's Interest

Recorded: 2017-05-12 Received: 2017-05-12 Pages: 3
Assignors
KURATOMI, BUNSHI
Executed: 2003-08-07
SHIMIZU, FUKUMI
Executed: 2003-08-07
Assignees
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
3-2, FUJIHASHI 3-CHOME, OME-SHI, TOKYO, JPX, JAPAN
Covered Properties (3)
Fabrication Method of Semiconductor Integrated Circuit Device
Application: 12/729,102 →
Fabrication Method of Semiconductor Integrated Circuit Device
Application: 12/118,348 →
Semiconductor Integrated Circuit Device and Imaging System
Application: 11/000,415 →