Mosfet package
View Patent ↗A semiconductor device featuring a semiconductor chip including a MOSFET and having a first main surface and a second, opposing main surface, a source electrode pad and a gate electrode pad over the first main surface, a drain electrode over the second main surface, a source external terminal and a gate external terminal, each having a first main surface electrically connected to the source electrode pad and gate electrode pad of the chip, respectively, and a drain external terminal having a first main surface and a second, opposing main surface and being electrically connected to the second main surface of the chip, each of the source, gate and drain external terminals having second main surfaces thereof in a same plane, and, in a plan view of the external terminals, the gate external terminal has a portion located between the source and drain external terminals in at least one direction.
1. A semiconductor device comprising:
a semiconductor chip including a MOSFET and having a first main surface and a second main surface opposite the first main surface, wherein a source electrode pad and a gate electrode pad are formed over the first main surface, and a drain electrode is formed over the second main surface;
a source external terminal having a first main surface electrically connected to the source electrode pad of the semiconductor chip and a second main surface opposite the first main surface;
a gate external terminal having a first main surface electrically connected to the gate electrode pad of the semiconductor chip and a second main surface opposite the first main surface;
a drain external terminal having a first main surface and a second main surface opposite the first main surface and being electrically connected to the second main surface of the semiconductor chip; and
a sealing body having a first surface and a second surface opposite the first surface and sealing a semiconductor chip and a part of each of the source, gate, and drain external terminals,
wherein the first surface of the sealing body faces to the same direction as a direction to which each of the first main surfaces of the source, gate, and drain external terminals faces,
wherein the second surface of the sealing body faces to the same direction as a direction to which each of the second main surfaces of the source, gate, and drain external terminals faces,
wherein each of the second main surfaces of the source, gate, and drain external terminals is in a same plane,
wherein each of the second main surfaces of the source and gate external terminals is exposed from the second surface inside of the second surface of the sealing body, and
wherein, in a second main surface view of each of the external terminals, the gate external terminal has a portion located between the source and drain external terminals in at least one direction.
2. The semiconductor device according to claim 1 ,
wherein the semiconductor chip is mounted over the source and gate external terminals such that the first main surface of the semiconductor chip faces to each of the first main surfaces of the source and gate external terminals.
3. The semiconductor device according to claim 2 ,
wherein each of the source and gate electrode pads of the semiconductor chip electrically connects to each of the source and gate external terminals via a conductive material.
4. The semiconductor device according to claim 1 ,
wherein, in the second main surface view of each of the external terminals, a part of the sealing body is disposed between the source and gate external terminals.
5. The semiconductor device according to claim 1 ,
wherein the drain external terminal has a first portion electrically connected to the second main surface of the semiconductor chip and a second portion which includes the second main surface of the drain external terminal, and
wherein the first and second portions are integrated with each other.
6. The semiconductor device according to claim 1 ,
wherein the second main surface of each of the source, gate, and drain external terminals is a surface which can be soldered.
7. The semiconductor device according to claim 1 ,
wherein the drain external terminal has a portion which extends from the second main surface of the semiconductor chip toward the first main surface thereof.
8. The semiconductor device according to claim 1 ,
wherein the second main surface of the semiconductor chip electrically connects to the drain external terminal via a conductive material.