Patent Assignment
Reel/Frame 042356/0468
Merger
Recorded: 2017-05-12
Pages: 11
Assignor
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Executed: 2013-10-01
Assignee
RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
11-3, SHINBASHI 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties
(26)
A Lead Bonding Machine for Bonding Leads of a Chip Disposed Over a Carrier Tape to an Electrode Pad Formed on the Chip
Patent:
6,279,226 →
Application:
09/003,516 →
Image Input System
Patent:
6,499,663 →
Application:
09/529,651 →
Semiconductor device and an electronic device
Patent:
6,335,566 →
Application:
09/646,712 →
Method of Driving Semiconductor Switching Device in Non-Saturated State and Power Supply Apparatus Containing Such a Switching Device
Patent:
6,381,152 →
Application:
09/651,722 →
High Frequency Power Amplifying Module and Wireless Communication Apparatus
Patent:
6,492,872 →
Application:
09/657,237 →
Radio communication apparatus and radio frequency power amplifier
Patent:
6,288,612 →
Application:
09/722,563 →
Method of Manufacturing Semiconductor Integrated Circuit Device
Direct-Current Power-Supply Apparatus, Control Circuit Thereof and Semiconductor Integrated Circuit Device for Power Supply
A Semiconductor Device Switching Regulator Used as a Dc Regulated Power Supply
Radio Communication Apparatus and Radio Frequency Power Amplifier
Circuit Design Method and Circuit Design Apparatus
Manufacturing Method of Semiconductor Device
Semiconductor Device Manufacturing Method and Semiconductor Device Sorting System to Be Used with the Same
Method for Manufacturing Semiconductor Integrated Circuit Device
Method for Manufacturing Semiconductor Device
Drive Control System for Sensor-Less Motor
Method of Bonding Inner Leads to Chip Pads
Semiconductor Integrated Circuit Device and Imaging System
Semiconductor Integrated Circuit Device and Imaging System
Image Input System
Method for Manufacturing Semiconductor Integrated Circuit Device
Mosfet Package
Mosfet Package
Mosfet Package
Mosfet Package
Mosfet Package
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger
Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRRONICS CORPORATION
Reel/Frame 024933/0869 →
Change of Name
Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0404 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Assignment of Assignor's Interest
May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0183 →
Assignment of Assignor's Interest
May 12, 2017
From: AIBARA, YASUTOSHI; NAKAJIMA, HIROKI; IMAIZUMI, EIKI; MATSUURA, TATSUJI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0200 →
Assignment of Assignor's Interest
May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0246 →
Corrective Assignment to Correct the the Assignment to Reflect the Previously Noted Co-Assignee Hitachi Tohbu Semiconductor, Ltd. Previously Recorded at Reel: 011557 Frame: 0368. Assignor(S) Hereby Confirms the Assignment.
May 12, 2017
From: IDA, TSUTOMU; ISHIZU, AKIO; HASHIZUME, MASAKAZU; HAGIWARA, ISAO
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042452/0627 →
Corrective Assignment to Correct the Assignee Previously Recorded at Reel: 01375 Frame: 0262. Assignor(S) Hereby Confirms the Assignment.
May 12, 2017
From: FUKUDA, MASANORI; INABA, HISATO; SUGIMOTO, HIROAKI
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042452/0644 →
Merger and Change of Name
May 12, 2017
From: HITACHI TOKYO ELECTRONICS CO., LTD.; EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042453/0172 →
Change of Name
May 12, 2017
From: HITACHI TOHBU SEMICONDUCTOR, LTD.
To: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 042458/0080 →
Change of Name
May 12, 2017
From: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0166 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Assignment of Assignor's Interest
May 12, 2017
From: OHKUBO, TATSUYUKI; NADAMOTO, KEISUKE; KATAYAMA, YOSHIFUMI
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 042356/0354 →
Assignment of Assignor's Interest
May 12, 2017
From: UENO, HIROTAKA; NUNOGAWA, YASUHIRO; ADACHI, TETSUAKI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0130 →
Assignment of Assignor's Interest
May 12, 2017
From: YAHAGI, KOUICHI; KASAHARA, MASUMI; NAKAJIMA, HIROKI
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0171 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →