Patent Assignment
Reel/Frame 042356/0354
Assignment of Assignor's Interest
Recorded: 2017-05-12
Pages: 3
Assignors
OHKUBO, TATSUYUKI
Executed: 1998-01-19
NADAMOTO, KEISUKE
Executed: 1998-01-19
KATAYAMA, YOSHIFUMI
Executed: 1998-01-19
Assignees
HITACHI, LTD.
CHIYODA-KU, TOKYO, JAPAN
HITACHI TOKYO ELECTRONICS CO., LTD.
OME-SHI, TOKYO, JAPAN
Covered Property
(1)
Method of Bonding Inner Leads to Chip Pads
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Merger and Change of Name
May 12, 2017
From: HITACHI TOKYO ELECTRONICS CO., LTD.; EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042453/0172 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →