IP Library › Assignment 042453/0172
Patent Assignment
Reel/Frame 042453/0172

Merger and Change of Name

Recorded: 2017-05-12 Pages: 25
Assignors
Assignee
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
14-1, KYOBASHI 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Properties (4)
A Lead Bonding Machine for Bonding Leads of a Chip Disposed Over a Carrier Tape to an Electrode Pad Formed on the Chip
Patent: 6,279,226 →
Application: 09/003,516 →
Manufacturing Method of Semiconductor Device
Patent: 6,767,782 →
Application: 10/082,311 →
Publication: US 2002/0168827
Method for Manufacturing Semiconductor Device
Patent: 6,730,594 →
Application: 10/279,827 →
Publication: US 2003/0087513
Method of Bonding Inner Leads to Chip Pads
Patent: 6,898,848 →
Application: 10/318,246 →
Publication: US 2003/0084563
Related Assignments (16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2001
From: OHKUBO, TATSUYUKI; NADANOTO, KEISUKE; KATAYAMA, YOSHIFUMI
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 011870/0809 →
Assignment of Assignor's Interest May 17, 2002
From: SAIKAWA, TAKESHI; MAENO, RYOHEI; OKUDAIRA, SADAYUKI; SAITO, TETSUO
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 013030/0228 →
Assignment of Assignor's Interest Oct 25, 2002
From: NOGUCHI, JUNJI; HAMADA, NAOHIDE
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 013423/0174 →
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014559/0807 →
Assignment of Assignor's Interest Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014587/0315 →
Assignment of Assignor's Interest Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0109 →
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Merger Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRRONICS CORPORATION
Reel/Frame 024933/0869 →
Change of Name Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0404 →
Assignment of Assignor's Interest Mar 25, 2011
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0976 →
Assignment of Assignor's Interest May 12, 2017
From: OHKUBO, TATSUYUKI; NADAMOTO, KEISUKE; KATAYAMA, YOSHIFUMI
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 042356/0354 →
Merger May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Change of Name May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →