Patent Assignment
Reel/Frame 014587/0315
Assignment of Assignor's Interest
Recorded: 2003-10-15
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Bonding Inner Leads to Chip Pads
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Assignment of Assignor's Interest
May 12, 2017
From: OHKUBO, TATSUYUKI; NADAMOTO, KEISUKE; KATAYAMA, YOSHIFUMI
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 042356/0354 →
Merger
May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Merger and Change of Name
May 12, 2017
From: HITACHI TOKYO ELECTRONICS CO., LTD.; EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042453/0172 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →