Patent Assignment
Reel/Frame 014190/0109
Assignment of Assignor's Interest
Recorded: 2003-12-11
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2003-09-12
Assignee
RENESAS TECHNOLOGY CORPORATION
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 17, 2002
From: SAIKAWA, TAKESHI; MAENO, RYOHEI; OKUDAIRA, SADAYUKI; SAITO, TETSUO
To: HITACHI, LTD.; HITACHI TOKYO ELECTRONICS CO., LTD.
Reel/Frame 013030/0228 →
Merger
Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRRONICS CORPORATION
Reel/Frame 024933/0869 →
Change of Name
Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0404 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger
May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Merger and Change of Name
May 12, 2017
From: HITACHI TOKYO ELECTRONICS CO., LTD.; EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042453/0172 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →