IP Library Assignment 013030/0228
Patent Assignment
Reel/Frame 013030/0228

Assignment of Assignor's Interest

Recorded: 2002-05-17 Pages: 3
Assignors
SAIKAWA, TAKESHI
Executed: 2002-04-12
MAENO, RYOHEI
Executed: 2002-04-15
OKUDAIRA, SADAYUKI
Executed: 2002-04-19
SAITO, TETSUO
Executed: 2002-04-12
TAMARU, TSUYOSHI
Executed: 2002-04-15
OHMORI, KAZUTOSHI
Executed: 2002-04-15
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU TOKYO, JAPAN
HITACHI TOKYO ELECTRONICS CO., LTD.
3-2, FUJIHASHI 3-CHOME ONE-SHI, TOKYO, JAPAN
Covered Property (1)
Manufacturing Method of Semiconductor Device
Patent: 6,767,782 →
Application: 10/082,311 →
Publication: US 2002/0168827
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0109 →
Merger Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRRONICS CORPORATION
Reel/Frame 024933/0869 →
Change of Name Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0404 →
Merger May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Merger and Change of Name May 12, 2017
From: HITACHI TOKYO ELECTRONICS CO., LTD.; EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042453/0172 →
Change of Name May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →