Patent Assignment
Reel/Frame 011870/0809
Assignment of Assignor's Interest
Recorded: 2001-06-07
Pages: 2
Assignors
OHKUBO, TATSUYUKI
Executed: 1998-01-19
NADANOTO, KEISUKE
Executed: 1998-01-19
KATAYAMA, YOSHIFUMI
Executed: 1998-01-19
Assignees
HITACHI, LTD.
CHIYODA-KU, 6, KANDA SURUGADAI 4-CHOME, TOKYO, JAPAN
HITACHI TOKYO ELECTRONICS CO., LTD.
CHIYODA-KU, OME-SHI, TOKYO, JAPAN
Covered Property
(1)
A Lead Bonding Machine for Bonding Leads of a Chip Disposed Over a Carrier Tape to an Electrode Pad Formed on the Chip
Patent:
6,279,226 →
Application:
09/003,516 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2011
From: HITACHI, LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0976 →
Merger
May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Merger and Change of Name
May 12, 2017
From: HITACHI TOKYO ELECTRONICS CO., LTD.; EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042453/0172 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →