IP Library › Assignment 042458/0080
Patent Assignment
Reel/Frame 042458/0080

Change of Name

Recorded: 2017-05-12 Pages: 12
Assignor
HITACHI TOHBU SEMICONDUCTOR, LTD.
Executed: 2002-10-01
Assignee
EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
3-2, FUJIHASHI 3-CHOME, OME-SHI, TOKYO, JAPAN
Covered Properties (17)
Image Input System
Patent: 6,499,663 →
Application: 09/529,651 →
Semiconductor device and an electronic device
Patent: 6,335,566 →
Application: 09/646,712 →
Method of Driving Semiconductor Switching Device in Non-Saturated State and Power Supply Apparatus Containing Such a Switching Device
Patent: 6,381,152 →
Application: 09/651,722 →
High Frequency Power Amplifying Module and Wireless Communication Apparatus
Patent: 6,492,872 →
Application: 09/657,237 →
Radio communication apparatus and radio frequency power amplifier
Patent: 6,288,612 →
Application: 09/722,563 →
Method of Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,709,890 →
Application: 09/783,605 →
Publication: US 2001/0014490
Direct-Current Power-Supply Apparatus, Control Circuit Thereof and Semiconductor Integrated Circuit Device for Power Supply
Patent: 6,496,395 →
Application: 09/809,997 →
Publication: US 2001/0026462
A Semiconductor Device Switching Regulator Used as a Dc Regulated Power Supply
Patent: 6,492,689 →
Application: 09/842,015 →
Publication: US 2001/0035554
Radio Communication Apparatus and Radio Frequency Power Amplifier
Patent: 6,384,686 →
Application: 09/881,013 →
Publication: US 2001/0040481
Circuit Design Method and Circuit Design Apparatus
Patent: 6,578,184 →
Application: 09/939,590 →
Publication: US 2002/0032896
Semiconductor Device Manufacturing Method and Semiconductor Device Sorting System to Be Used with the Same
Patent: 6,787,374 →
Application: 10/083,503 →
Publication: US 2002/0182759
Method for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,803,271 →
Application: 10/187,003 →
Publication: US 2003/0032233
Drive Control System for Sensor-Less Motor
Patent: 6,900,604 →
Application: 10/291,831 →
Publication: US 2003/0107337
Semiconductor Integrated Circuit Device and Imaging System
Patent: 7,122,775 →
Application: 10/816,925 →
Publication: US 2004/0189842
Semiconductor Integrated Circuit Device and Imaging System
Patent: 6,841,770 →
Application: 10/817,042 →
Publication: US 2004/0182992
Image Input System
Patent: 7,278,577 →
Application: 10/823,642 →
Publication: US 2004/0196392
Method for Manufacturing Semiconductor Integrated Circuit Device
Patent: 7,084,055 →
Application: 10/930,845 →
Publication: US 2005/0026358
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRRONICS CORPORATION
Reel/Frame 024933/0869 →
Change of Name Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0404 →
Assignment of Assignor's Interest May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Assignment of Assignor's Interest May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0183 →
Assignment of Assignor's Interest May 12, 2017
From: AIBARA, YASUTOSHI; NAKAJIMA, HIROKI; IMAIZUMI, EIKI; MATSUURA, TATSUJI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0200 →
Assignment of Assignor's Interest May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0246 →
Assignment of Assignor's Interest May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0260 →
Merger May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Corrective Assignment to Correct the the Assignment to Reflect the Previously Noted Co-Assignee Hitachi Tohbu Semiconductor, Ltd. Previously Recorded at Reel: 011557 Frame: 0368. Assignor(S) Hereby Confirms the Assignment. May 12, 2017
From: IDA, TSUTOMU; ISHIZU, AKIO; HASHIZUME, MASAKAZU; HAGIWARA, ISAO
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042452/0627 →
Corrective Assignment to Correct the Assignee Previously Recorded at Reel: 01375 Frame: 0262. Assignor(S) Hereby Confirms the Assignment. May 12, 2017
From: FUKUDA, MASANORI; INABA, HISATO; SUGIMOTO, HIROAKI
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042452/0644 →
Change of Name May 12, 2017
From: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0166 →
Change of Name May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Assignment of Assignor's Interest May 12, 2017
From: FUJIWARA, TSUYOSHI; ASAKA, KATSUYUKI; NARIYOSHI, YASUHIRO; HOSHINO, YOSHINORI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0257 →
Assignment of Assignor's Interest May 12, 2017
From: UENO, HIROTAKA; NUNOGAWA, YASUHIRO; ADACHI, TETSUAKI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0130 →
Assignment of Assignor's Interest May 12, 2017
From: YAHAGI, KOUICHI; KASAHARA, MASUMI; NAKAJIMA, HIROKI
To: HITACHI, LTD.; HITACHI TOHBU SEMICONDUCTOR, LTD.
Reel/Frame 042356/0171 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →