Patent Assignment
Reel/Frame 042356/0139
Assignment of Assignor's Interest
Recorded: 2017-05-12
Pages: 4
Assignors
KAJIWARA, RYOICHI
Executed: 1999-12-28
KOIZUMI, MASAHIRO
Executed: 1999-12-28
MORITA, TOSHIAKI
Executed: 1999-12-28
TAKAHASHI, KAZUYA
Executed: 1999-12-28
KISHIMOTO, MUNEHISA
Executed: 1999-12-28
ISHII, SHIGERU
Executed: 1999-12-28
HIRASHIMA, TOSHINORI
Executed: 1999-12-28
TAKAHASHI, YASUSHI
Executed: 1999-12-28
HATA, TOSHIYUKI
Executed: 1999-12-28
SATO, HIROSHI
Executed: 1999-12-28
OOKAWA, KEIICHI
Executed: 1999-12-28
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI TOHBU SEMICONDUCTOR, LTD.
1-1, NISHIYOKOTE MACHI, TAKASAKI-SHI, GUNMA, 370-0021, JAPAN
Covered Properties
(5)
Mosfet Package
Mosfet Package
Mosfet Package
Mosfet Package
Mosfet Package
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Address of Assignee
Aug 27, 2013
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 031095/0721 →
Merger and Change of Name
May 12, 2017
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 042355/0837 →
Assignment of Assignor's Interest
May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 042356/0150 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger
May 12, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042356/0468 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →