Patent Application
Utility
App. No. 10/059,338
· Confirmation No. 7467
BALL GRID ARRAY TYPE SEMICONDUCTOR PACKAGE HAVING A FLEXIBLE SUBSTRATE
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-01-31 | TRNA |
Transmittal of New Application | 2 | View | |
| 2002-01-31 | A.PE |
Preliminary Amendment | 8 | View | |
| 2002-01-31 | SPEC |
Specification | 33 | View | |
| 2002-01-31 | CLM |
Claims | 3 | View | |
| 2002-01-31 | ABST |
Abstract | 1 | View | |
| 2002-01-31 | DRW |
Drawings-only black and white line drawings | 22 | View | |
| 2002-01-31 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Atsushi Fujisawa
Hakodate-shi, JAPAN
Takafumi Konno
Hakodate-shi, JAPAN
Shingo Ohsaka
Hakodate-shi, JAPAN
Ryo Haruta
Tokyo, JAPAN
Masahiro Ichitani
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/666
H10W74/00
H10W74/016
H10W74/117
H10W70/681
H10W72/354
H10W72/536
H10W72/884
H10W72/073
H10W72/5363
H10W72/931
H10W72/932
H10W72/07353
H10W72/075
H10W99/00
H10W72/0198
H10W90/754
H10W72/5522
H10W72/334
H10W90/734
H10W72/352
H10W72/5449
H10W70/656
Prosecution
- Examiner
- CAO, PHAT X
- Art Unit
- 2814
- Customer No.
- 20457
- Docket No.
- 501.36384CV6
- Confirmation No.
- 7467
Foreign Priority
9-204534
·
1997-07-30
·
JAPAN
Publication
- Pub. No.
- US20020079579A1
- Pub. Date
- 2002-06-27
Patent Term Adjustment
-58days
from
HITACHI, LTD.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2011-03-25
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Quick Facts
- App. No.
- 10/059,338
- Filed
- 2002-01-31
- Granted
- 2002-11-05
- Pub. No.
- US20020079579A1
- Examiner
- CAO, PHAT X
- Art Unit
- 2814
- PTA
- -58 days
External Links