IP Library Granted Patent US 7,315,363
Granted Patent B2
US 7,315,363 · App. 10/722,531 · Granted Jan 1, 2008

Inspection method and inspection apparatus

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Quick Facts
Patent No.
US 7,315,363
App. No.
10/722,531
Granted
Jan 1, 2008
Kind
B2
Abstract

The present invention provides an inspection apparatus and inspection method. The inspection apparatus provided by the present invention comprises an illumination optical system which illuminates light to an object under inspection; a detection optical system which detects light reflected from said object and converts the detected light into an image signal; a spatial filter which is provided in said detection optical system to selectively shield diffracted light pattern coming from a circuit pattern existing on the object by combining light-shielding points of minute dots state; an arithmetic processing system which processes the image signal detected by said detection optical system; and a monitor which observes foreign matters/defects based on a signal processed by said arithmetic processing system.

Claims (27)

1. An inspection apparatus, comprising:

an illumination optical system which illuminates light to an object under inspection;

a detection optical system which detects light reflected from said object and converts the detected light into an image signal;

a spatial filter which is provided in said detection optical system to selectively shield diffracted light pattern coming from a circuit pattern existing on the object by combining light-shielding points of minute dots state;

an arithmetic processing system which processes the image signal detected by said detection optical system;

a monitor which observes foreign matters/defects based on a signal processed by said arithmetic processing system;

a cartridge equipped with a plurality of substrates for forming said spatial filter;

a cleaner which cleans said substrates of said cartridge; and

a printer which prints the Fourier transformed image of the circuit pattern under inspection of the object onto the substrates of said cartridge.

2. The inspection apparatus according to claim 1 , wherein said detection optical system comprises a Fourier transform lens which Fourier transforms the diffracted light reflected from the circuit pattern of said object, and an inverse Fourier transform lens which inverse Fourier transforms light obtained trough said spatial filter.

3. An inspection apparatus further comprising:

a stage which mounts an object under inspection and moves said object in a three-dimensional direction;

an illumination optical system which illuminates light to said object;

a detection optical system which detects light reflected from said object and converts the detected light into an image signal, said detection optical system comprising:

a Fourier transform lens which Fourier transforms diffracted light coming from said circuit pattern said object, and

an inverse Fourier transform lens which inverse Fourier transforms light coming through said spatial filter;

a spatial filter which is provided in said detection optical system and prints so as to shield a Fourier transformed image generated from a circuit patter existing on the object;

an arithmetic processing system which processes the image signal detected by said detection optical system;

a monitor which observes foreign matters/defects based on a signal processed by said arithmetic processing system;

a cartridge equipped with a plurality of substrates for forming said spatial filter;

a cleaner which cleans said substrates of said cartridge; and

a printer which prints the Fourier transformed image onto the substrates of said cartridge.

4. The inspection apparatus according to claim 3 , wherein, if said circuit patterns existed on the object are included a plurality of different kind circuit patterns, spatial filter appropriate for each kind circuit pattern arid spatial filter appropriate for a combination of some of said kind circuit patterns are provided so as to inspect a foreign matter/defect on the plurality of the different kind circuit patterns.

5. The inspection apparatus according to claim 1 , wherein said printer is a dot printer, wherein D≦P where D is dot size and P is print pitch, and wherein interpolation is provided for gap between dots.

6. The inspection apparatus according to claim 3 , wherein said printer is a dot printer, wherein D≦P where D is dot size and P is print pitch, and wherein interpolation is provided for gap between dots.

7. The inspection apparatus according to claim 5 , wherein D≦1/50×φ if a diameter of Fourier transform plane within a circuit pattern of said object is φ.

8. The inspection apparatus according to claim 6 , wherein D≦1/50×φ if a diameter of Fourier transform plane within a circuit pattern of said object is φ.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2005
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016547/0110 →
CHANGE OF NAME Recorded Jul 27, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015642/0021 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2003
From: HAMAMATSU, AKIRA; NOGUCHI, MINORI; NISHIYAMA, HIDETOSHI; OHSHIMA, YOSHIMASA; JINGU, TAKAHIRO; UTO, SACHIO
To: HITACHI ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 014748/0046 →