Patent Assignment
Reel/Frame 018137/0410
Assignment of Assignor's Interest
Recorded: 2006-07-24
Pages: 5
Assignors
GOTO, AKIHIRO
Executed: 2006-04-14
MATSUSHIMA, HIRONORI
Executed: 2006-04-14
OGAWA, HIROSHIGE
Executed: 2006-04-14
MATSUDA, YOSHIO
Executed: 2006-04-17
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-6334, JAPAN
Covered Property
(1)
Wiring Design Support Apparatus for Bond Wire of Semiconductor Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 15, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024990/0129 →
Merger
Sep 15, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024990/0153 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →