IP Library › Assignment 018137/0541
Patent Assignment
Reel/Frame 018137/0541

Assignment of Assignor's Interest

Recorded: 2006-08-18 Pages: 4
Assignors
ADKISSON, JAMES W.
Executed: 2006-07-26
GAMBINO, JEFFREY P.
Executed: 2006-07-26
JAFFE, MARK D.
Executed: 2006-07-26
RASSEL, RICHARD J.
Executed: 2006-08-04
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Bond Pad for Wafer and Package for Cmos Imager
Patent: 7,622,364 →
Application: 11/465,622 →
Publication: US 2008/0042292
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 22, 2018
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: SMARTSENS TECHNOLOGY (CAYMAN) CO., LTD.
Reel/Frame 046664/0305 →