Patent Assignment
Reel/Frame 018147/0398
Assignment of Assignor's Interest
Recorded: 2006-07-25
Pages: 3
Assignors
PARK, HONG-SICK
Executed: 2006-05-10
KIM, SHI-YUL
Executed: 2006-05-10
CHOUNG, JONG-HYUN
Executed: 2006-05-10
SHIN, WON-SUK
Executed: 2006-05-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Photoresist Stripper Composition and Methods for Forming Wire Structures and for Fabricating Thin Film Transistor Substrate Using Composition
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.