Patent Assignment
Reel/Frame 018158/0317
Assignment of Assignor's Interest
Recorded: 2006-08-03
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Trench Isolation of Semiconductor Device