IP Library › Assignment 018179/0297
Patent Assignment
Reel/Frame 018179/0297

Assignment of Assignor's Interest

Recorded: 2006-08-04 Pages: 3
Assignors
CHO, JAE-HEE
Executed: 2006-07-21
LEEM, DONG-SEOK
Executed: 2006-07-21
SEONG, TAE-YEON
Executed: 2006-07-21
SONE, CHEOL-SOO
Executed: 2006-07-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method of Forming Ohmic Contact Layer and Method of Fabricating Light Emitting Device Having Ohmic Contact Layer
Patent: 8,580,668 →
Application: 11/435,827 →
Publication: US 2006/0270206
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →