Patent Assignment
Reel/Frame 018189/0074
Assignment of Assignor's Interest
Recorded: 2006-08-30
Pages: 4
Assignors
HSU, LOUIS LU-CHEN
Executed: 2006-08-09
MANDELMAN, JACK ALLAN
Executed: 2006-08-03
TONTI, WILLIAM ROBERT
Executed: 2006-08-08
YANG, CHIH-CHAO
Executed: 2006-08-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Interconnect Structures with Liner Repair Layers and Methods for Forming Such Interconnection Structures