Patent Assignment
Reel/Frame 018191/0260
Assignment of Assignor's Interest
Recorded: 2006-08-18
Pages: 2
Assignor
OGAWA, YASUKI
Executed: 2006-08-01
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON, 1-CHOME, MINATO-KU, TOKO, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.