IP Library › Assignment 018193/0362
Patent Assignment
Reel/Frame 018193/0362

Assignment of Assignor's Interest

Recorded: 2006-08-31 Pages: 3
Assignors
SCHUEHRER, HOLGER
Executed: 2006-01-16
LETZ, TOBIAS
Executed: 2006-01-16
KOSCHINSKY, FRANK
Executed: 2006-01-16
Assignee
ADVANCED MICRO DEVICES, INC.
5204 EAST BEN WHITE BOULEVARD, AUSTIN, TEXAS, 78741
Covered Property (1)
Method for Removing a Passivation Layer Prior to Depositing a Barrier Layer in a Copper Metallization Layer
Patent: 7,820,536 →
Application: 11/468,834 →
Publication: US 2007/0123034
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 19, 2020
From: ADVANCED MICRO DEVICES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 051861/0682 →