Patent Assignment
Reel/Frame 018197/0255
Assignment of Assignor's Interest
Recorded: 2006-08-17
Pages: 2
Assignors
HIGAKI, KENJIRO
Executed: 2006-04-17
TAKAGI, DAISUKE
Executed: 2006-04-17
ISHIDU, SADAMU
Executed: 2006-04-17
TSUZUKI, YASUSHI
Executed: 2006-04-17
Assignee
A. L. M. T. CORP.
11-11, SHIBA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Collective Substrate, Semiconductor Element Mount, Semiconductor Device, Imaging Device, Light Emitting Diode Component and Light Emitting Diode