Patent Assignment
Reel/Frame 018200/0394
Assignment of Assignor's Interest
Recorded: 2006-09-01
Pages: 3
Assignor
HUNG, JUI-WEN
Executed: 2006-08-28
Assignee
FOXCONN TECHNOLOGY CO., LTD.
3-2,CHUNG SHAN ROAD, TU-CHENG,TAIPEI HSIEN, TAIWAN
Covered Property
(1)
Heat Dissipation Module for Electronic Device