IP Library Assignment 018204/0561
Patent Assignment
Reel/Frame 018204/0561

Assignment of Assignor's Interest

Recorded: 2006-08-17 Pages: 2
Assignors
LEE, JAE-CHANG
Executed: 2006-08-16
LEE, CHANG-SEUNG
Executed: 2006-08-16
CHUNG, JAE-WOO
Executed: 2006-08-16
KIM, DUCK-SU
Executed: 2006-08-16
LEE, KYO-YEOL
Executed: 2006-08-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Silicon wet etching method using parylene mask and method of manufacturing nozzle plate of inkjet printhead using the same
Application: 11/505,416 →
Publication: US 2007/0134928
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 25, 2010
From: SAMSUNG ELECTRONICS CO., LTD
To: SAMSUNG ELECTRO-MECHANICS CO., LTD
Reel/Frame 023989/0439 →