Patent Assignment
Reel/Frame 023989/0439
Change of Name
Recorded: 2010-02-25
Pages: 5
Assignor
SAMSUNG ELECTRONICS CO., LTD
Executed: 2010-01-14
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(26)
Method of Forming Hydrophobic Coating Layer on Surface of Nozzle Plate of Inkjet Printhead
Piezoelectric Inkjet Printhead and Method of Manufacturing the Same
Inkjet Printhead Employing Piezoelectric Actuator and Method of Manufacturing the Inkjet Printhead
Inkjet Printhead Having Piezoelectric Actuator and Method of Driving the Piezoelectric Actuator
Piezoelectric Inkjet Printhead
Silicon wet etching method using parylene mask and method of manufacturing nozzle plate of inkjet printhead using the same
Application:
11/505,416 →
Publication:
US 2007/0134928
Piezoelectric Actuator Inkjet Head and Method of Forming the Same
Method of Forming Thick Layer by Screen Printing and Method of Forming Piezoelectric Actuator of Inkjet Head
Method of Forming Piezoelectric Actuator of Inkjet Head
Nozzle Drive Control Device and Method
Inkjet Printhead Having Bezel Structure to Remove Ink Bubbles
Application:
11/756,021 →
Publication:
US 2008/0043077
Inkjet Printhead Using Non-Aqueous Ink
Nozzle Plate for Inkjet Head and Method of Manufacturing the Nozzle Plate
Nozzle Plate of Inkjet Printhead and Method of Manufacturing the Nozzle Plate
Inkjet Head Including Plurality of Restrictors to Restrain Crosstalk
Method and Apparatus to Detect Print Location Error Using Print Dots
Method and Apparatus to Check Piezoelectric Inkjet Head
Piezo-Electric Type Inkjet Printhead
Piezo-Electric Type Page Width Inkjet Printhead and Image Forming Apparatus Having the Same
Method of Measuring Volumes of Ink Droplets and Method of Controlling Nozzles of Inkjet Head Using the Method
Apparatus to Print Printing Patterns Using Inkjet Technique and Method Thereof
Application:
11/859,932 →
Publication:
US 2008/0266350
Method of Forming High-Density Thick Piezoelectric Layer and Piezoelectric Device Including High-Density Thick Piezoelectric Layer Formed Using the Method
Application:
11/877,717 →
Publication:
US 2008/0122319
Piezoelectric Inkjet Head
Application:
11/923,863 →
Publication:
US 2008/0309736
Method of Poling Piezoelectric Actuator
Application:
11/936,838 →
Publication:
US 2009/0015102
Piezoelectric Inkjet Printhead and Method of Manufacturing the Same
Method of Forming Piezoelectric Actuator of Inkjet Head
Application:
12/553,511 →
Publication:
US 2009/0322829
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 20, 2006
From: KANG, SUNG-GYU; BACK, KAE-DONG; LIM, SEUNG-MO; CHUNG, JAE-WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017815/0488 →
Assignment of Assignor's Interest
Jun 21, 2006
From: CHUNG, JAE-WOO; LEE, HWA-SUN; KIM, JI-HOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018031/0749 →
Assignment of Assignor's Interest
Jun 27, 2006
From: LEE, HWA-SUN; LEE, KYO-YEOL; LEE, TAE-KYUNG; MOON, CHANG-YOUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018054/0558 →
Assignment of Assignor's Interest
Jul 25, 2006
From: LIM, SEUNG-MO; LEE, TAE-KYUNG; MOON, CHANG-YOUL; CHUNG, JAE-WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018129/0640 →
Assignment of Assignor's Interest
Aug 17, 2006
From: LEE, JAE-CHANG; LEE, CHANG-SEUNG; CHUNG, JAE-WOO; KIM, DUCK-SU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018204/0561 →
Assignment of Assignor's Interest
Aug 31, 2006
From: LEE, JAE-CHANG; CHUNG, JAE-WOO; LEE, KYO-YEOL; LEE, CHANG-SEUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018195/0460 →
Assignment of Assignor's Interest
Oct 17, 2006
From: LEE, TAE-KYUNG; CHUNG, JAE-WOO; LEE, KYO-YEOL; LEE, HWA-SUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018429/0704 →
Assignment of Assignor's Interest
Oct 17, 2006
From: LEE, KYO-YEOL; LEE, TAE-KYUNG; CHUNG, JAE-WOO; LEE, HWA-SUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018429/0711 →
Assignment of Assignor's Interest
Oct 20, 2006
From: LIM, SEUNG-MO; LEE, KYO-YEOL; CHUNG, JAE-WOO; LEE, HWA-SUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018446/0895 →
Assignment of Assignor's Interest
Jan 16, 2007
From: KIM, SUNG-WOOK; KIM, BYUNG-HUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018810/0191 →
Assignment of Assignor's Interest
May 31, 2007
From: HONG, YOUNG-KI; CHUNG, JAE-WOO; KIM, JONG-BEOM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019361/0664 →
Assignment of Assignor's Interest
May 31, 2007
From: CHA, TAE-WOON; LEE, TAE-KYUNG; CHUNG, JAE-WOO
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 019361/0760 →
Assignment of Assignor's Interest
Jun 19, 2007
From: CHA, TAE-WOON; KWON, YOUNG-NAM; LEE, JAE-CHANG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019445/0996 →
Assignment of Assignor's Interest
Jun 21, 2007
From: CHA, TAE-WOON; LIM, SEUNG-MO; KANG, SUNG-GYU; CHUNG, JAE-WOO
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 019464/0187 →
Assignment of Assignor's Interest
Jun 25, 2007
From: HONG, YOUNG-KI; LEE, TAE-KYUNG; CHUNG, JAE-WOO
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 019472/0249 →
Assignment of Assignor's Interest
Jun 29, 2007
From: KIM, BYUNG-HUN
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 019498/0145 →
Assignment of Assignor's Interest
Jul 10, 2007
From: KIM, WOO-SIK; KWON, KYE-SI; KIM, SEONG-JIN; SHIN, SEUNG-JOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019535/0983 →
Assignment of Assignor's Interest
Jul 10, 2007
From: LEE, TAE-KYUNG; WEE, SANG-KWON; CHUNG, JAE-WOO; CHA, TAE-WOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019537/0272 →