IP Library Granted Patent US 7,926,177
Granted Patent B2
US 7,926,177 · App. 11/425,204 · Granted Apr 19, 2011

Method of forming hydrophobic coating layer on surface of nozzle plate of inkjet printhead

Assignee: Samsung Electro-Mechanics Co., Ltd.
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Quick Facts
Patent No.
US 7,926,177
App. No.
11/425,204
Granted
Apr 19, 2011
Kind
B2
Abstract

A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.

Claims (21)

1. A method of forming a hydrophobic layer on a nozzle plate of an inkjet printhead, the nozzle plate having inner and outer surfaces and a plurality of nozzles having nozzle openings and inner nozzle surfaces, the method comprising:

forming a first layer of a predetermined material on the outer surface of the nozzle plate to cover the nozzle openings;

forming a second layer of a predetermined material on the inner surface of the nozzles plate to cover the inner nozzle surfaces and the nozzle openings;

removing the first layer to uncover the outer surface of the nozzle plate and to expose portions of the second layer through the nozzle openings;

forming the hydrophobic layer on the outer surface of the nozzle plate, the nozzle openings, and the exposed portions of the second layer; and

removing the second layer and the portion of the hydrophobic layer that was formed on the exposed portions of the second layer.

2. The method of claim 1 , wherein the second layer comprises a metal layer having at least one metal compound.

3. The method of claim 1 , wherein the second layer comprises a plurality of metal layers, each having at least one metal compound.

4. The method of claim 1 , wherein the second layer comprises a polymer layer having at least one polymer material.

5. The method of claim 4 , wherein the at least one polymer material is a light sensitive polymer material.

6. The method of claim 1 , wherein the second layer comprises a plurality of polymer layers, each having at least one polymer material.

7. The method of claim 1 , wherein a thickness of a first portion of the second layer formed on upper portions of the inner nozzle surfaces is greater than a thickness of a second portion of the second layer on remaining portions of the inner nozzle surfaces.

8. The method of claim 1 , wherein the forming of the hydrophobic layer includes forming the hydrophobic layer on upper portions of the inner nozzle surfaces located within a predetermined distance from the nozzle openings.

9. The method of claim 8 , further comprising:

etching the second layer to a predetermine depth before forming the hydrophobic layer to uncover the upper portions of the inner nozzle surfaces.

10. The method of claim 1 , further comprising:

forming an intermediate layer on the inner surface of the nozzle plate; and

forming the second layer on the intermediate layer.

11. The method of claim 10 , wherein the intermediate layer includes at least one metal and the second layer includes at least one metal.

12. The method of claim 10 , wherein the intermediate layer includes a metal and the second layer also includes the metal.

13. The method of claim 10 , wherein the intermediate layer comprises a plurality of metal layers.

Assignments (2)
CHANGE OF NAME Recorded Feb 25, 2010
From: SAMSUNG ELECTRONICS CO., LTD
To: SAMSUNG ELECTRO-MECHANICS CO., LTD
Reel/Frame 023989/0439 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2006
From: KANG, SUNG-GYU; BACK, KAE-DONG; LIM, SEUNG-MO; CHUNG, JAE-WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017815/0488 →
Priority Claims (2)
KR 10-2005-0113498 · Nov 25, 2005 · national
KR 10-2005-0124379 · Dec 16, 2005 · national
Continuity (1)
Related Publication 20070120889A1 · May 31, 2007