Piezoelectric inkjet printhead and method of manufacturing the same

1. A piezoelectric inkjet printhead, comprising:

an upper substrate including an ink inlet formed therethrough to allow an inflow of ink;

a lower substrate formed of a silicon-on-insulator substrate and including a manifold connected with the ink inlet, a plurality of pressure chambers arranged along at least one side of the manifold and connected with the manifold, a plurality of dampers connected with the pressure chambers, and a plurality of nozzles connected with the dampers; and

a piezoelectric actuator formed on the upper substrate to apply a driving force to the plurality of pressure chambers to eject the ink,

wherein the upper substrate is stacked and bonded directly on the lower substrate.

2. The piezoelectric inkjet printhead of claim 1 , wherein the silicon-on-insulator substrate comprises:

a first silicon layer;

an intervening oxide layer; and

a second silicon layer including the manifold, the pressure chambers, and the dampers are formed therein,

wherein the nozzles are formed through the first silicon layer and the intervening oxide layer.

3. The piezoelectric inkjet printhead of claim 2 , wherein the dampers have a depth substantially equal to a thickness of the second silicon layer between the upper substrate and the intervening oxide layer functioning as an etch stop layer, and the nozzles have a length substantially equal to a total thickness of the first silicon layer and the intervening oxide layer or substantially equal to a thickness of the first silicon layer.

4. The piezoelectric inkjet printhead of claim 2 , wherein the manifold has a depth smaller than the thickness of the second silicon layer, and the pressure chambers have a depth smaller than the depth of the manifold.

5. The piezoelectric inkjet printhead of claim 1 , wherein the upper substrate is formed of a single crystal silicon substrate or a silicon-on-insulator substrate.

6. The piezoelectric inkjet printhead of claim 1 , wherein the upper substrate functions as a vibrating plate deformable by an operation of the piezoelectric actuator.

7. The piezoelectric inkjet printhead of claim 1 , wherein the manifold, the pressure chambers, and the dampers comprise sidewalls inclined by wet etching with respect to an ink ejecting direction.

8. The piezoelectric inkjet printhead of claim 7 , wherein first and second ends of each of the plurality of pressure chambers taper toward the manifold and corresponding ones of the plurality of dampers, respectively, and are connected to the manifold and the corresponding ones of the dampers, respectively.

9. The piezoelectric inkjet printhead of claim 1 , wherein the manifold, the pressure chambers, and the dampers comprise sidewalls vertically formed by dry etching with respect to an ink ejecting direction.

10. The piezoelectric inkjet printhead of claim 9 , wherein first and second ends of each of the plurality of pressure chambers are connected to the manifold and corresponding ones of the plurality of dampers, respectively.

11. The piezoelectric inkjet printhead of claim 1 , wherein the nozzles are formed into a vertical hole shape having a constant diameter by dry etching.

12. The piezoelectric inkjet printhead of claim 1 , wherein the piezoelectric actuator comprises:

a lower electrode formed on the upper substrate;

a piezoelectric layer formed on the lower electrode above each of the pressure chambers; and

an upper electrode formed on the piezoelectric layer to apply a voltage to the piezoelectric layer.

13. The piezoelectric inkjet printhead of claim 12 , wherein a silicon oxide layer is formed between the upper substrate and the lower electrode as an insulating layer.

14. A printhead, comprising:

an upper silicon substrate including an ink inlet to allow an inflow of ink into the printhead;

a lower silicon substrate having first and second silicon layers separated by an intervening oxide layer, the first silicon layer and the intervening layer including a plurality of nozzles to eject the ink, and the second silicon layer including a plurality of pressure chambers to contain the ink, a manifold to supply the ink from the ink inlet to the pressure chambers, and a plurality of dampers to connect the nozzles to the plurality of pressure chambers; and

an ink flow path defined by the ink inlet, the manifold, the plurality of pressure chambers, the plurality of dampers, and the plurality of nozzles,

wherein the upper silicon substrate is stacked directly on the lower silicon substrate.

15. The printhead of claim 14 , wherein each of the dampers comprises:

a first end connected to a corresponding one of the plurality of pressure chambers and having a first size; and

a second end connected to a corresponding one of the plurality of nozzles and having a second size that is smaller than the first size.

16. The printhead of claim 14 , wherein each of the dampers comprises:

a first end connected to a corresponding one of the plurality of pressure chambers;

a second end connected to a corresponding one of the plurality of nozzles; and

sloped sidewalls extending from the first end to the second end.

17. The printhead of claim 14 , wherein each of the dampers comprises:

a first end connected to a corresponding one of the plurality of pressure chambers;

a second end connected to a corresponding one of the plurality of nozzles; and

vertical sidewalls extending from the first end to the second end.

18. The printhead of claim 14 , wherein each of the manifold, the plurality of pressure chambers, and the plurality of dampers has sloped sidewalls.

19. The printhead of claim 14 , wherein each of the manifold, the plurality of pressure chambers, and the plurality of dampers has vertical sidewalls.

20. The printhead of claim 14 , wherein a thickness of the first silicon layer is about 30 μm to about 100 μm, a thickness of the intervening oxide layer is about 0.3 μm to about 2 μm, and a thickness of the second silicon layer is about 200 μm.

21. The printhead of claim 14 , wherein a depth of each of the plurality of dampers corresponds to a thickness of the second silicon layer.

22. The printhead of claim 14 , wherein a length of each of the plurality of nozzles corresponds to thicknesses of the intervening oxide layer and the first silicon layer.

23. The printhead of claim 14 , wherein each of the plurality of nozzles has a constant diameter.

24. The printhead of claim 14 , wherein the upper substrate has a thickness of about 5 μm to about 13 μm.

25. A piezoelectric printhead, comprising:

an upper silicon substrate including an ink inlet and a piezoelectric actuator; and

a lower silicon substrate including a first layer having a plurality of nozzles, a second layer having a plurality of pressure chambers, a manifold, and a plurality of dampers, and an etch stop layer such that the plurality of nozzles has a uniform shape,

wherein the upper silicon substrate is stacked and bonded directly on the lower silicon substrate.