Patent Assignment
Reel/Frame 018212/0287
Assignment of Assignor's Interest
Recorded: 2006-09-06
Pages: 4
Assignor
YOKOYAMA, KIYOSHI
Executed: 2006-06-26
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Bonded Body, Wafer Support Member Using the Same, and Wafer Treatment Method