Patent Assignment
Reel/Frame 018227/0304
Assignment of Assignor's Interest
Recorded: 2006-09-11
Pages: 3
Assignor
YANG, HUNG-MO
Executed: 2006-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Having Scribe Lanes Suitable for Sawing Process, Reticle Used in Manufacturing the Same, and Method of Manufacturing the Same