Patent Assignment
Reel/Frame 018229/0445
Assignment of Assignor's Interest
Recorded: 2006-08-21
Pages: 5
Assignors
SHIMOMURA, TETSUO
Executed: 2006-08-10
KAZUNO, ATSUSHI
Executed: 2006-08-10
OGAWA, KAZUYUKI
Executed: 2006-08-10
NAKAI, YOSHIYUKI
Executed: 2006-08-10
NAKAMORI, MASAHIKO
Executed: 2006-08-10
YAMADA, TAKATOSHI
Executed: 2006-08-10
Assignee
TOYO TIRE & RUBBER CO., LTD.
17-18, EDOBORI 1-CHOME, NISHI-KU, OSAKA-SHI, OSAKA 550-8661, JAPAN
Covered Property
(1)
Polishing Pad and Method for Manufacture of Semiconductor Device Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.