Patent Assignment
Reel/Frame 018232/0835
Assignment of Assignor's Interest
Recorded: 2006-09-05
Pages: 2
Assignors
LIN, MOU-SHIUNG
Executed: 2006-07-20
CHOU, CHIEN-KANG
Executed: 2006-07-20
CHEN, KE-HUNG
Executed: 2006-07-20
Assignee
MEGIC CORPORATION
NO. 21, R & D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Post Passivation Structure for a Semiconductor Device and Packaging Process for Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 018405/0508 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →