Patent Assignment
Reel/Frame 018240/0846
Assignment of Assignor's Interest
Recorded: 2006-09-08
Pages: 3
Assignors
SHIMOMURA, TETSUO
Executed: 2006-08-30
NAKAMORI, MASAHIKO
Executed: 2006-08-30
YAMADA, TAKATOSHI
Executed: 2006-08-30
OGAWA, KAZUYUKI
Executed: 2006-08-30
KAZUNO, ATSUSHI
Executed: 2005-08-30
WATANABE, MASAHIRO
Executed: 2006-08-30
Assignee
TOYO TIRE & RUBBER CO., LTD.
17-18, EDOBORI 1-CHOME, NISHI-KU, OSAKA-SHI, OSAKA, 550-8661, JAPAN
Covered Property
(1)
Polishing Pad and Semiconductor Device Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.