Patent Assignment
Reel/Frame 018254/0377
Assignment of Assignor's Interest
Recorded: 2006-09-01
Pages: 2
Assignee
INTERUNIVERSITAIR MICROELECTRONICA CENTRUM (IMEC) VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Methods for Bonding and Micro-Electronic Devices Produced According to Such Methods