IP Library › Assignment 018254/0617
Patent Assignment
Reel/Frame 018254/0617

Assignment of Assignor's Interest

Recorded: 2006-08-30 Pages: 2
Assignors
NAKAJIMA, AKISHIGE
Executed: 2006-06-20
SHIGENO, YASUSHI
Executed: 2006-06-20
OGAWA, TAKASHI
Executed: 2006-06-21
OSAKABE, SHINYA
Executed: 2006-06-20
ISHIKAWA, TOMOYUKI
Executed: 2006-06-20
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Integrated Circuit Device and High Frequency Power Ampifier Module
Patent: 7,650,134 →
Application: 11/512,189 →
Publication: US 2007/0049352
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Assignment of Assignor's Interest Mar 28, 2012
From: RENESAS ELECTRONICS CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027946/0388 →