Patent Assignment
Reel/Frame 018263/0787
Assignment of Assignor's Interest
Recorded: 2006-09-05
Pages: 2
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Resin Mold Type Semiconductor Device